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Signal Integrity Issues and Printed Circuit Board Design Douglas Brooks
Publisher: Prentice Hall International

DesignCon 2012 promises to address issues around PCB design tools, RF and signal integrity, FPGA design, IC and semiconductor components, verification tools, and high-speed serial design. Signal Integrity Issues and Printed Circuit Board Design, Author: Douglas Brooks. This article presents a brief overview of board level simulation for high-speed, multilayer PCB design and highlights some common traps and some tips so hopefully you get it right first time. Its low dielectric constant and low dissipation factor make it an ideal candidate for broadband circuit designs requiring fast signal speeds or improved signal integrity. PCB design is mostly about signal integrity, controlled impedance lines, EM coupling, and supply decoupling. Thickness of the material, to accommodate complex multilayer designs while keeping overall thickness low. When electrons move down a trace or a wire, current flows. For high-speed digital applications, the use of RO4350B with LoPro foil enables circuit designers to not only preserve signal integrity but, with the 0.004-in. One way that most electrical engineers have traditionally dealt with the problem of temperature rises at the circuit-board level has been by specifying printed-circuit materials with lower dissipation factors. By Douglas Brooks – Current is the flow of electrons. So although the package and your clock speed have not changed a problem may exist for legacy designs. I don't know of a good reference that addresses all the issues. There are 3D mechanical packages and some PCB software have in built pretty 3D sections where you can view your design in 3D, if you havn't got a real 3d modeling package or an IDF interface. It is a world wide problem with losing skilled PCB personel. Download Free eBook:Emc & the Printed Circuit Board: Design, Theory, & Layout Made Simple (repost) - Free chm, pdf ebooks rapidshare download, ebook torrents bittorrent download.